Burn-in socket
We have a track record of deliveries to major domestic semiconductor manufacturers.
**Features** - By compacting the socket mechanism, the socket size has been minimized, reducing the mounting area on the circuit board. - You can select suitable contacts that match your usage conditions (contacts for room temperature applications are available). - It has a PKG separation mechanism to address sticking issues that occur during burn-in testing. - By machining the socket adapter, it can accommodate a variety of package shapes. **Specifications** - Contact pressure: 11–14g/pin (for high temperature) 17–22g/pin (for room temperature) - Initial contact resistance: 200–300mΩ - Operating temperature: -40 to +150℃ - Maximum allowable current: 0.6amp *For more details, please feel free to contact us.*
- Company：ＳＤＫ
- Price：Other
